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  TPC8010-H 2002-03-12 1 toshiba field effect transistor silicon n channel mos type (high speed u-mosiii) TPC8010-H dc-dc converters notebook pc applications portable equipment applications  small footprint due to small and thin package  high speed switching  small gate charge: q g = 18 nc (typ.)  low drain-source on resistance: r ds (on) = 12 m ? (typ.)  high forward transfer admittance: |y fs | = 11 s (typ.)  low leakage current: i dss = 10 a (max) (v ds = 30 v)  enhancement mode: v th = 1.1 to 2.3 v (v ds = 10 v, i d = 1 ma) maximum ratings (ta     25c) characteristics symbol rating unit drain-source voltage v dss 30 v drain-gate voltage (r gs  20 k  ) v dgr 30 v gate-source voltage v gss  20 v dc (note 1) i d 11 drain current pulse (note 1) i dp 44 a drain power dissipation (t  10 s) (note 2a) p d 1.9 w drain power dissipation (t  10 s) (note 2b) p d 1.0 w single pulse avalanche energy (note 3) e as 157 mj avalanche current i ar 11 a repetitive avalanche energy (note 2a) (note 4) e ar 0.19 mj channel temperature t ch 150 c storage temperature range t stg  55 to 150 c note: for (note 1), (note 2), (note 3) and (note 4), please refer to the next page. this transistor is an electrostatic sensitive device. please handle with caution. unit: mm jedec D jeita D toshiba 2-6j1b weight: 0.080 g (typ.) circuit configuration 8 6 1 2 3 7 5 4
TPC8010-H 2002-03-12 2 thermal characteristics characteristics symbol max unit thermal resistance, channel to ambient (t  10 s) (note 2a) r th (ch-a) 65.8 c/w thermal resistance, channel to ambient (t  10 s) (note 2b) r th (ch-a) 125 c/w marking (note 5) note 1: please use devices on condition that the channel temperature is below 150c. note 2: (a) device mounted on a glass-epoxy board (a) (b) device mounted on a glass-epoxy board (b) note 3: v dd  24 v, t ch  25c (initial), l  1.0 mh, r g  25  , i ar  11 a note 4: repetitive rating: pulse width limited by maximum channel temperature note 5:  on lower left of the marking indicates pin 1. shows lot number. (year of manufacture: last decimal digit of the year of manufacture, month of manufacture: january to december are denoted by letters a to l respectively.) type tpc8010 h (a) fr-4 25.4  25.4  0.8 (unit: mm) (b) fr-4 25.4  25.4  0.8 (unit: mm)
TPC8010-H 2002-03-12 3 electrical characteristics (ta     25c) characteristics symbol test condition min typ. max unit gate leakage current i gss v gs   16 v, v ds  0 v    10  a drain cut-off current i dss v ds  30 v, v gs  0 v   10  a v (br) dss i d  10 ma, v gs  0 v  30   drain-source breakdown voltage v (br) dsx i d  10 ma, v gs   20 v  15   v gate threshold voltage v th v ds  10 v, i d  1 ma 1.1  2.3 v v gs  4.5 v, i d  5.5 a  16 25 drain-source on resistance r ds (on) v gs  10 v, i d  5.5 a  12 16 m  forward transfer admittance |y fs | v ds  10 v, i d  5.5 a  5.5 11  s input capacitance c iss  1020  reverse transfer capacitance c rss  120  output capacitance c oss v ds  10 v, v gs  0 v, f  1 mhz  400  pf rise time t r  3.1  turn-on time t on  11  fall time t f  3.4  switching time turn-off time t off duty  1%, t w  10  s   23  ns v dd
 24 v, v gs  10 v, i d  11 a  18  total gate charge (gate-source plus gate-drain) q g v dd
 24 v, v gs  5 v, i d  11 a  10  gate-source charge 1 q gs1  2.6  gate-drain (?miller?) charge q gd  4.4  gate switch charge q sw v dd
 24 v, v gs  10 v, i d  11 a  5.5  nc source-drain ratings and characteristics (ta     25c) characteristics symbol test condition min typ. max unit drain reverse current pulse (note 1) i drp    44 a forward voltage (diode) v dsf i dr  11 a, v gs  0 v    1.2 v r l  2.7  v dd
 15 v 0 v v gs 10 v 4.7  i d  5.5 a v out
TPC8010-H 2002-03-12 4 forward transfer admittance |y fs | (s) drain-source voltage v ds (v) drain-source voltage v ds (v) i d ? v ds drain current i d (a) drain-source voltage v ds (v) i d ? v ds drain current i d (a) gate-source voltage v gs (v) i d ? v gs drain current i d (a) gate-source voltage v gs (v) v ds ? v gs drain current i d (a) |y fs | ? i d drain current i d (a) drain-source on resistance r ds (on) (m  ) r ds (on) ? i d 0 2 4 6 8 10 0 2 4 6 8 10 common source ta  25c pulse test v gs  2 v 2.4 2.5 3 10 2.6 2.2 5 2.8 2.7 2.3 4 4 8 12 16 20 common source ta  25c pulse test 2.6 2.5 2.4 2.3 v gs  2.1 v 2.7 10 3 0 8 12 16 20 4 04 2.8 5 0 0 1 2 3 4 5 10 20 30 40 100 ta   55c common source v ds  10 v pulse test 25 0.6 0 0.2 0.4 0.8 1 0 2 4 6 10 12 8 common source ta  25c pulse test i d  11 a 5.5 2.5 common source v ds  10 v pulse test 0.1 1 10 100 0.3 1 3 10 30 100 ta   55c 100 25 common source ta  25c pulse test 30 10 3 1 0.3 0.1 1 3 10 30 100 10 v gs  4.5 v
TPC8010-H 2002-03-12 5 ambient temperature ta (c) r ds (on) ? ta drain-source on resistance r ds (on) (m  ) drain-source voltage v ds (v) i dr ? v ds drain reverse current i dr (a) drain-source voltage v ds (v) capacitance ? v ds capacitance c (pf) ambient temperature ta (c) v th ? ta gate threshold voltage v th (v) ambient temperature ta (c) p d ? ta drain power dissipation p d (w) gate-source voltage v gs (v) total gate charge q g (nc) dynamic input/output characteristics drain-source voltage v ds (v) 0.1 1 10 100 5 50 0.5 30 3 0.3 30 1000 100 500 5000 50 300 3000 10 c iss c oss c rss common source v gs  0 v f  1 mhz ta  25c 0 1.5 2.5  80  40 0 40 80 160 120 0.5 2 1 common source v ds  10 v i d  1 ma pulse test 0 0 0.4 0.8 1.2 1.6 2 50 100 150 200 (1) device mounted on a glass-epoxy board (a) (note 2a) (2) device mounted on a glass-epoxy board (b) (note 2b) t  10 s (1) (2) 0 15 25  80  40 0 40 80 160 120 5 20 10 common source pulse test i d  11, 5.5, 2.5 a 10 v gs  4.5 v i d  11, 5.5, 2.5 a 0.1 1 10 100 common source ta  25c pulse test 0  0.4  0.6  0.8  1.2  0.2  1 v gs  0 v 1 3 5 10 30 20 0 0 1 10 15 20 10 40 common source i d  11 a ta  25c pulse test v dd  24 v v ds 12 6 v gs v dd  24 v 6 12 0 8 16 12 4
TPC8010-H 2002-03-12 6 r th  t w safe operating area pulse width t w (s) drain-source voltage v ds (v) transient thermal impedance r th (c/w) drain current i d (a) 0.01 0.01 0.1 1 10 100 0.1 1 10 100 *: single pulse ta  25c curves must be derated linearly with increase in temperature. i d max (pulse) * 10 ms * 1 ms * v dss max 0.3 0.001 0.01 0.1 10 100 1000 1 100 1000 single pulse 1 (2) 10 (1) 3 30 300 (1) device mounted on a glass-epoxy board (a) (note 2a) (2) device mounted on a glass-epoxy board (b) (note 2b) t  10 s
TPC8010-H 2002-03-12 7  toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc..  the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk.  the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others.  the information contained herein is subject to change without notice. 000707ea a restrictions on product use


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